JPS6211013Y2 - - Google Patents
Info
- Publication number
- JPS6211013Y2 JPS6211013Y2 JP15525081U JP15525081U JPS6211013Y2 JP S6211013 Y2 JPS6211013 Y2 JP S6211013Y2 JP 15525081 U JP15525081 U JP 15525081U JP 15525081 U JP15525081 U JP 15525081U JP S6211013 Y2 JPS6211013 Y2 JP S6211013Y2
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- heat sink
- piece
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 230000017525 heat dissipation Effects 0.000 description 10
- 238000005476 soldering Methods 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 4
- 210000000078 claw Anatomy 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15525081U JPS5860945U (ja) | 1981-10-19 | 1981-10-19 | 放熱装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15525081U JPS5860945U (ja) | 1981-10-19 | 1981-10-19 | 放熱装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5860945U JPS5860945U (ja) | 1983-04-25 |
| JPS6211013Y2 true JPS6211013Y2 (en]) | 1987-03-16 |
Family
ID=29947825
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15525081U Granted JPS5860945U (ja) | 1981-10-19 | 1981-10-19 | 放熱装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5860945U (en]) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5728865B2 (ja) * | 2010-01-07 | 2015-06-03 | 株式会社リコー | 放熱機構、及び放熱板の支え金具 |
-
1981
- 1981-10-19 JP JP15525081U patent/JPS5860945U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5860945U (ja) | 1983-04-25 |
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